Welcome!

Wireless Authors: Karyn Price, Andrew Mathew, Ian Thain, AfterLogic Team, Nazli Ekim

Related Topics: Wireless

Wireless: Article

450mm Wafers Next

Intel Wants to Transition from 300mm to 450mm Wafers In 2012
By Maureen O'Gara
Article Rating:
May 11, 2008 09:00 AM EDT
Reads:
 3,108

Intel wants to transition from 300mm to 450mm wafers in 2012 and has gotten Samsung and TSMC to agree to an “industry-wide collaboration” to ensure that everything’s in place and there are pilot lines being tested by then.

It should mean lower-cost MPUs, diminish overall use of resources per chip and cut air pollution, global warming gases and water use.

A joint push should improve ROI and cut R&D and transition costs “substantially.”

They say it’s a “potential solution to maintain a reasonable cost structure for the industry.”

Published May 11, 2008 – Reads 3,108
Copyright © 2008 SYS-CON Media, Inc. — All Rights Reserved.
Syndicated stories and blog feeds, all rights reserved by the author.

About Maureen O'Gara

Maureen O'Gara the most read technology reporter for the past 20 years, is the Cloud Computing and Virtualization News Desk editor of SYS-CON Media. She is the publisher of famous "Billygrams" and the editor-in-chief of "Client/Server News" for more than a decade. One of the most respected technology reporters in the business, Maureen can be reached by email at maureen(at)sys-con.com or paperboy(at)g2news.com, and by phone at 516 759-7025.

Comments (0)

Share your thoughts on this story.

Add your comment
You must be signed in to add a comment. Sign-in | Register

In accordance with our Comment Policy, we encourage comments that are on topic, relevant and to-the-point. We will remove comments that include profanity, personal attacks, racial slurs, threats of violence, or other inappropriate material that violates our Terms and Conditions, and will block users who make repeated violations. We ask all readers to expect diversity of opinion and to treat one another with dignity and respect.