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450mm Wafers Next

Intel Wants to Transition from 300mm to 450mm Wafers In 2012

Intel wants to transition from 300mm to 450mm wafers in 2012 and has gotten Samsung and TSMC to agree to an “industry-wide collaboration” to ensure that everything’s in place and there are pilot lines being tested by then.

It should mean lower-cost MPUs, diminish overall use of resources per chip and cut air pollution, global warming gases and water use.

A joint push should improve ROI and cut R&D and transition costs “substantially.”

They say it’s a “potential solution to maintain a reasonable cost structure for the industry.”

More Stories By Maureen O'Gara

Maureen O'Gara the most read technology reporter for the past 20 years, is the Cloud Computing and Virtualization News Desk editor of SYS-CON Media. She is the publisher of famous "Billygrams" and the editor-in-chief of "Client/Server News" for more than a decade. One of the most respected technology reporters in the business, Maureen can be reached by email at maureen(at)sys-con.com or paperboy(at)g2news.com, and by phone at 516 759-7025.

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