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450mm Wafers Next

Intel Wants to Transition from 300mm to 450mm Wafers In 2012
By Maureen O'Gara
Article Rating:
May 11, 2008 09:00 AM EDT
Reads:
 3,221

Intel wants to transition from 300mm to 450mm wafers in 2012 and has gotten Samsung and TSMC to agree to an “industry-wide collaboration” to ensure that everything’s in place and there are pilot lines being tested by then.

It should mean lower-cost MPUs, diminish overall use of resources per chip and cut air pollution, global warming gases and water use.

A joint push should improve ROI and cut R&D and transition costs “substantially.”

They say it’s a “potential solution to maintain a reasonable cost structure for the industry.”

Published May 11, 2008 – Reads 3,221
Copyright © 2008 SYS-CON Media, Inc. — All Rights Reserved.
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More Stories By Maureen O'Gara

Maureen O'Gara the most read technology reporter for the past 20 years, is the Cloud Computing and Virtualization News Desk editor of SYS-CON Media. She is the publisher of famous "Billygrams" and the editor-in-chief of "Client/Server News" for more than a decade. One of the most respected technology reporters in the business, Maureen can be reached by email at maureen(at)sys-con.com or paperboy(at)g2news.com, and by phone at 516 759-7025.

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