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Industrial 'Internet of Things' from @Spansion | @ThingsExpo [#IoT]

Spansion Adds 96 New MCUs to FM4 Family for Industrial IoT

Spansion Inc. (NYSE: CODE), a global leader in embedded systems, added 96 new products to the Spansion® FM4 Family of flexible microcontrollers (MCUs).

Based on the ARM® Cortex®-M4F core, the new MCUs boast a 200 MHz operating frequency and support a diverse set of on-chip peripherals for enhanced human machine interfaces (HMIs) and machine-to-machine (M2M) communications. The rich set of peripherals and large memory allow single-chip solutions for a wide variety of applications including factory automation, industrial Internet of Things (IoT), motor control, office automation, building management systems, smart meters, digital cameras and multi-function printers.

"With 200 MHz operating frequency and 2 MB flash, the S6E2C series MCUs support more than a dozen of the latest and most popular high-speed communications standards ideal for M2M communications and industrial IoT. The dual-bank flash array allows seamless over-the-air (OTA) in-application reprogramming," said Dhiraj Handa, senior vice president and general manager, Spansion Multi-Market Microcontroller Business. "We also uniquely offer robust 5V I/O on a high-performance, large-memory MCU. This eases design since designers only need one regulator for a 5V MCU and can continue to use the 5V logic and power drivers common to industrial embedded applications."

Key Features and Benefits of the Spansion S6E2C Series

Very high performance: Spansion S6E2C series MCUs are based on ARM Cortex-M4F with a maximum operating frequency of 200 MHz. The architecture is optimized for efficient data movement with a 16kB flash accelerator, allowing zero wait state execution. Peripheral-to-RAM and RAM-to-peripheral data movement is possible without CPU intervention by either an 8-channel DMA or the unique and powerful descriptor system data transfer controller (DSTC).

Up to 2MB flash and 256 KB SRAM memory: Spansion flash has an industry-leading native 72 MHz access speed. The flash memory is divided into two independent sections which allows one to be erased and programmed while the other runs code. The high-density RAM supports the large memory requirements of operating systems and is very useful for buffering audio information or Ethernet traffic.

Support for more than a dozen different communications and memory interfaces:
Spansion S6E2C series MCUs accommodate the following interfaces:

  • Ethernet – for high speed bulk data transfers;
  • CAN and CAN-FD – for automotive and industrial time critical networks. CAN-FD allows a flexible data rate and larger packet size making it ideal for Industrial IoT;
  • NOR flash, NAND flash, SDRAM and SRAM memory devices;
  • Secure Digital Input Output (SDIO) – for high speed Wi-Fi chipsets and portable devices such as digital cameras, GPS navigation devices or handheld consoles;
  • Full-speed Universal Serial Bus (USB) – Both host and device modes supported;
  • Integrated Interchip Sound (I2S) – the standard interface for digital audio and connecting digital audio devices together;
  • High Definition Multimedia Interface – Consumer Electronics Control (HDMI-CEC) – which enables one A/V component to control another;
  • General purpose serial interface – Combination of up to 16 channels of UAR, SPI, I2C or LIN communication interfaces. The user determines which function is assigned to each channel.

Motor control functionality:

  • Spansion has boosted the motor control functionality by including 3 high-speed analog-to-digital converters and 3 complex timer blocks.

Industrial and safety critical applications benefit from the programmable cyclic redundancy check for memory validation, flash ECC, a clock supervisor and dual watchdog timers.

Availability and Pricing

Spansion S6E2C series MCU samples are shipping now and production volumes will be available in the first quarter of 2015 starting at $10.00 per unit for minimum volumes of 1,500 units.

Spansion Resources:

About Spansion
Spansion (NYSE: CODE) is a global leader in flash memory-based embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http://www.spansion.com.

Spansion(R), the Spansion logo, and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. ARM and Cortex are registered trademarks of ARM Limited. Other names used are for informational purposes only and may be trademarks of their respective owners.

Conference Schedule Announced

Are you ready to put your data in the cloud?

What is the future of security in the cloud?

Does Docker quickly advance the development of an IoT application?

What are the implications of Moore's Law on Hadoop deployments?

Get all these questions and hundreds more like them answered at the 15th Cloud Expo, November 4-6, 2014, at the Santa Clara Convention Center, in Santa Clara, CA. The Cloud Expo / Big Data Expo / @ThingsExpo / DevOps Summit programs are now available for you to inspect and investigate in advance.

Our upcoming November 4-6 event in Santa Clara, California will present a total of 10 simultaneous tracks by an all-star faculty, over three days, plus a two-day "Cloud Computing Bootcamp" presented by Janakiram MSV, an Analyst with the Gigaom Research analyst network, where he covers the Cloud Services landscape.

Cloud and Big Data topics and tracks include: Enterprise Cloud Adoption, APM & Cloud Computing | Hot Topics, Cloud APIs & Business, Cloud Security | Mobility, Big Data | Analytics.

@ThingsExpo content tripled from a single track in New York to three simultaneous tracks: Consumer IoT, Enterprise IoT, IoT Developer | WebRTC Convergence.

DevOps Summit also doubled from a single track in New York to two simultaneous tracks: "Dev" Developer Focus and "Ops" Operations Focus.

Schedule for Cloud Expo / Big Data Expo / @ThingsExpoHere

Schedule for DevOps SummitHere

Now that we have published the full conference schedule, please check back for daily updates as we finalize new session abstracts by working with our distinguished faculty members. For your questions please contact us at events (at) sys-con.com. Last but not least we will announce our keynotes on the hottest subjects to be delivered by world-class speakers!

The largest 'Internet of Things' event in the world has announced "sponsorship opportunities" and "call for papers."

The 1st International Internet of @ThingsExpo was launched this June at the Javits Center in New York City with over 6,000 delegates in attendance. The 2nd International Internet of @ThingsExpo will take place November 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, California, with an estimated 7,000 plus delegates attending over three days.

@ThingsExpo is co-located with 15th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading IoT industry players in the world. In 2014, more than 200 companies will be present on the @ThingsExpo show floor, including global players and the hottest new technology pioneers.

Sponsorship and Exhibit Opportunities for @ThingsExpo Silicon Valley and New York Are Now Available
Sponsors and exhibitors of Internet of @ThingsExpo will benefit from unmatched branding, profile building and lead generation opportunities through:

  • Featured on-site presentation and ongoing on-demand webcast exposure to a captive audience of industry decision-makers.
  • Showcase exhibition during our new extended dedicated expo hours
  • Breakout Session Priority scheduling for sponsors that have been guaranteed a 35-minute technical session
  • Online advertising in SYS-CON's i-Technology publications
  • Capitalize on our comprehensive marketing efforts leading up to the show with print mailings, e-newsletters and extensive online media coverage.
  • Unprecedented PR Coverage: Editorial coverage on IoT.sys-con.com, Tweets to our 75,000 plus followers, press releases sent on major wire services to over 500 combined analysts and press members who attended Internet of @ThingsExpo - making it the best-covered "Internet of Things" conference in the world

For more information on sponsorship, exhibit, and keynote opportunities contact Carmen Gonzalez by email at events (at) sys-con.com, or by phone 201 802-3021. Book both events for additional savings!

@ThingsExpo Silicon Valley (November 4-6, 2014, Santa Clara, CA)
@ThingsExpo New York (June 9-11, 2015, New York, NY)

Secure Your VIP Pass to Attend @ThingsExpo Silicon Valley
Internet of @ThingsExpo announced today a limited time free "Expo Plus" registration option. The onsite registration price of $600 will be set to 'free' for delegates who register during September.

To take advantage of this opportunity, attendees can use the coupon code "IoTSeptember" and secure their "@ThingsExpo Plus" registration to attend all keynotes and general sessions, as well as a limited number of technical sessions each day of the show, in addition to full access to the expo floor and the @ThingsExpo hackathon.

The registration page is located at the @ThingsExpo site here.


@ThingsExpo New York 2015 'Call for Papers' Now Open
The 3rd International Internet of @ThingsExpo, to be held June 9-11, 2015, at the Javits Center in New York City, New York announces that its 'Call for Papers' is now open. The event will feature a world class, all-star faculty with the hottest IoT topics covered in three distinct tracks.

Track 1 - Consumer IoT and Wearables: Smart Appliances, Wearables, Smart Cars, Smartphones 2.0, Smart Travel, Personal Fitness, Health Care, Personalized Marketing, Customized Shopping, Personal Finance, The Digital Divide, Mobile Cash & Markets, Games & the IoT, The Future of Education, Virtual Reality

Track 2 - Enterprise IoT: The Business Case for IoT, Smart Grids, Smart Cities, Smart Transportation, The Smart Home, M2M, Authentication/Security, Wiring the IoT, The Internet of Everything, Digital Transformation of Enterprise IT, Agriculture, Transportation, Manufacturing, Local & State Government, Federal Government

Track 3 - Developer IoT: WebRTC, Eclipse Foundation, Cloud Foundry, Docker & Linux Containers, Node-Red, Open Source Hardware, Leveraging SOA, Multi-Cloud IoT, Evolving Standards, WebSockets, Security & Privacy Protocols, GPS & Proximity Services, Bluetooth/RFID/etc., XMPP, Nest Labs


@ThingsExpo billboard is viewed by more than 1.3 million motorists per week on Highway 101, in the heart of Silicon Valley

Help plant your flag in the fast-expanding business opportunity that is the Internet of Things: Submit your speaking proposal today here!

Download @ThingsExpo Newsletter Today Here

Chris Matthieu Named @ThingsExpo Tech Chair

Internet of @ThingsExpo named Chris Matthieu tech chair of Internet of @ThingsExpo 2014 Silicon Valley.

Chris Matthieu has two decades of telecom and web experience. He launched his Teleku cloud communications-as-a-service platform at eComm in 2010, which was acquired by Voxeo. Next he built an open source Node.JS PaaS called Nodester, which was acquired by AppFog. His latest startups include Twelephone. Leveraging HTML5 and WebRTC, Twelephone's BHAG (Big Hairy Audacious Goal) is to become the next generation telecom company running in the Web browser. Chris is currently co-founder and CTO of Octoblu.

Website: http://www.ThingsExpo.com

Twitter: http://www.Twitter.com/ThingsExpo

About SYS-CON Media & Events
SYS-CON Media (www.sys-con.com) has since 1994 been connecting technology companies and customers through a comprehensive content stream - featuring over forty focused subject areas, from Cloud Computing to Web Security - interwoven with market-leading full-scale conferences produced by SYS-CON Events. The company's internationally recognized brands include among others Cloud Expo® (CloudComputingExpo.com / @CloudExpo), Big Data Expo (BigDataExpo.net / @BigDataExpo), DevOps Summit (DevOpsSummit.sys-con.com / @DevOpsSummit), Internet of @ThingsExpo (ThingsExpo.com / @ThingsExpo) and Cloud Computing Bootcamp (CloudComputingBootcamp.com).

Cloud Expo®, Big Data Expo® and @ThingsExpo® are registered trademarks of Cloud Expo, Inc., a SYS-CON Events company.

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