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@ThingsExpo: Article

Ti's Breakthrough Design for Wearables

Industry's smallest, lowest power battery charger and first fully integrated power module help extend battery run-time

Delivering power management innovation for ultra-low power designs, Texas Instruments (TI) introduced the industry's smallest, lowest power linear battery charger and a tiny, fully integrated DC/DC power module, which consumes only 360 nA of quiescent current, to help extend battery run-time in wearable electronics, remote sensors and MSP430™ microcontroller-based applications.

Smallest, lowest power linear charger
The new bq25100 single-cell Li-Ion charger comes in a 0.9-mm by 1.6-mm WCSP package, and achieves a solution half the size of existing charger solutions. The device supports input voltages up to 30 V, and allows accurate control of fast-charge currents as low as 10 mA or as high as 250 mA, and precise charge termination down to 1 mA to support tiny Li-Ion coin batteries. The bq25100 also can support a leakage current of less than 75 nA to extend standby operation.

Texas Instruments tiny power module extends battery life in next-generation smart watches.

Designers also can add wireless charging capability to small portable and wearable applications by pairing the bq51003 2.5-W, Qi-compliant wireless charging receiver with the bq25100 linear charger on the same board. Both devices are featured on a new TI Design reference board that measures 75 mm2. In addition, TI has been supporting Humavox, an Israeli company operating in the wireless power technology area, to integrate the bq25100 in its wireless charging solutions for wearable devices and portable healthcare devices under Humavox's ETERNA™ RF-based wireless charging platform.

MicroSiP power modules
TI's new TPS82740A and TPS82740B step-down converter modules support 200-mA output current with 95 percent conversion efficiency and consume only 360 nA of quiescent current during active operation and 70 nA during standby. The tiny modules rely on a fully integrated, 9-bump MicroSiP package, which incorporates a switching regulator, inductor and input/output capacitors to achieve a solution size of only 6.7 mm2.

The TPS82740A supports output voltages from 1.8 V to 2.5 V, while the TPS82740B supports 2.6 V to 3.3 V in 100-mV steps, which can meet power requirements of microcontrollers, such as TI's new ultra-low power MSP430FR59xx microcontrollers (MCUs), and Bluetooth® low energy solutions, such as the SimpleLink™ CC2540T wireless MCU.

Key benefits of the TPS82740A and TPS82740B:

  • Smallest 200-mA DC/DC solutions: Fully integrated MicroSiP modules include all passives, and achieve a 6.7-mm2 solution size, 75 percent smaller than discrete solutions.
  • Lowest power, highest performance: Operates at only 360-nA quiescent current and 70 nA during standby. An integrated load switch and a 3-pin voltage select function optimize power consumption on the fly during operation.

Ultra-low power design
The bq25100 charger and TPS82740A and TPS82740B MicroSiP modules expand TI's portfolio of ultra-low power battery management and DC/DC converters that help maintain longer battery life and even enable battery-free operation in low-power designs. The bq25570, bq25505, TPS62740, TPS62737 and TPS62736 power devices achieve the industry's lowest levels of active quiescent current.

Availability and pricing
The bq25100 is shipping in volume production, and is priced at US$0.75 each in 1,000-unit quantities. The easy-to-use bq25100EVM-654 evaluation module can be ordered via TI eStore™. The TPS82740A and TPS82740B power modules are also shipping in volume production. Both modules come in a 2.3-mm by 2.9-mm by 1.1-mm MicroSiP package, and are priced at US$1.55 each in 1,000-unit quantities. Designers can order the TPS82740AEVM-617 and TPS82740BEVM-617 evaluation modules and download the PSpice transient module simulation software to simplify design and reduce development time.

Find out more about TI's ultra-low power solutions by visiting the below links:

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

The largest 'Internet of Things' event in the world has announced "sponsorship opportunities" and "call for papers."

The 1st International Internet of @ThingsExpo was launched this June at the Javits Center in New York City with over 6,000 delegates in attendance. The 2nd International Internet of @ThingsExpo will take place November 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, California, with an estimated 7,000 plus delegates attending over three days.

@ThingsExpo is co-located with 15th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading IoT industry players in the world. In 2014, more than 200 companies will be present on the @ThingsExpo show floor, including global players and the hottest new technology pioneers.

Sponsorship and Exhibit Opportunities for @ThingsExpo Silicon Valley and New York Are Now Available
Sponsors and exhibitors of Internet of @ThingsExpo will benefit from unmatched branding, profile building and lead generation opportunities through:

  • Featured on-site presentation and ongoing on-demand webcast exposure to a captive audience of industry decision-makers.
  • Showcase exhibition during our new extended dedicated expo hours
  • Breakout Session Priority scheduling for sponsors that have been guaranteed a 35-minute technical session
  • Online advertising in SYS-CON's i-Technology publications
  • Capitalize on our comprehensive marketing efforts leading up to the show with print mailings, e-newsletters and extensive online media coverage.
  • Unprecedented PR Coverage: Editorial coverage on IoT.sys-con.com, Tweets to our 75,000 plus followers, press releases sent on major wire services to over 500 combined analysts and press members who attended Internet of @ThingsExpo - making it the best-covered "Internet of Things" conference in the world

For more information on sponsorship, exhibit, and keynote opportunities contact Carmen Gonzalez by email at events (at) sys-con.com, or by phone 201 802-3021. Book both events for additional savings!

@ThingsExpo Silicon Valley (November 4-6, 2014, Santa Clara, CA)
@ThingsExpo New York (June 9-11, 2015, New York, NY)

Secure Your VIP Pass to Attend @ThingsExpo Silicon Valley
Internet of @ThingsExpo announced today a limited time free "Expo Plus" registration option. The onsite registration price of $600 will be set to 'free' for delegates who register during September.

To take advantage of this opportunity, attendees can use the coupon code "IoTSeptember" and secure their "@ThingsExpo Plus" registration to attend all keynotes and general sessions, as well as a limited number of technical sessions each day of the show, in addition to full access to the expo floor and the @ThingsExpo hackathon.

The registration page is located at the @ThingsExpo site here.


@ThingsExpo New York 2015 'Call for Papers' Now Open
The 3rd International Internet of @ThingsExpo, to be held June 9-11, 2015, at the Javits Center in New York City, New York announces that its 'Call for Papers' is now open. The event will feature a world class, all-star faculty with the hottest IoT topics covered in three distinct tracks.

Track 1 - Consumer IoT and Wearables: Smart Appliances, Wearables, Smart Cars, Smartphones 2.0, Smart Travel, Personal Fitness, Health Care, Personalized Marketing, Customized Shopping, Personal Finance, The Digital Divide, Mobile Cash & Markets, Games & the IoT, The Future of Education, Virtual Reality

Track 2 - Enterprise IoT: The Business Case for IoT, Smart Grids, Smart Cities, Smart Transportation, The Smart Home, M2M, Authentication/Security, Wiring the IoT, The Internet of Everything, Digital Transformation of Enterprise IT, Agriculture, Transportation, Manufacturing, Local & State Government, Federal Government

Track 3 -  Developer IoT: WebRTC, Eclipse Foundation, Cloud Foundry, Docker & Linux Containers, Node-Red, Open Source Hardware, Leveraging SOA, Multi-Cloud IoT, Evolving Standards, WebSockets, Security & Privacy Protocols, GPS & Proximity Services, Bluetooth/RFID/etc., XMPP, Nest Labs


@ThingsExpo billboard is viewed by more than 1.3 million motorists per week on Highway 101, in the heart of Silicon Valley

Help plant your flag in the fast-expanding business opportunity that is the Internet of Things: Submit your speaking proposal today here!

Download @ThingsExpo Newsletter Today Here

Chris Matthieu Named @ThingsExpo Tech Chair

Internet of @ThingsExpo named Chris Matthieu tech chair of Internet of @ThingsExpo 2014 Silicon Valley.

Chris Matthieu has two decades of telecom and web experience. He launched his Teleku cloud communications-as-a-service platform at eComm in 2010, which was acquired by Voxeo. Next he built an open source Node.JS PaaS called Nodester, which was acquired by AppFog. His latest startups include Twelephone. Leveraging HTML5 and WebRTC, Twelephone's BHAG (Big Hairy Audacious Goal) is to become the next generation telecom company running in the Web browser. Chris is currently co-founder and CTO of Octoblu.

Website: http://www.ThingsExpo.com

Twitter: http://www.Twitter.com/ThingsExpo

About SYS-CON Media & Events
SYS-CON Media (www.sys-con.com) has since 1994 been connecting technology companies and customers through a comprehensive content stream - featuring over forty focused subject areas, from Cloud Computing to Web Security - interwoven with market-leading full-scale conferences produced by SYS-CON Events. The company's internationally recognized brands include among others Cloud Expo® (CloudComputingExpo.com / @CloudExpo), Big Data Expo (BigDataExpo.net / @BigDataExpo), DevOps Summit (DevOpsSummit.sys-con.com / @DevOpsSummit),  Internet of @ThingsExpo (ThingsExpo.com / @ThingsExpo) and Cloud Computing Bootcamp (CloudComputingBootcamp.com).

Cloud Expo® and Big Data Expo® are registered trademarks of Cloud Expo, Inc., a SYS-CON Events company.

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