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The GaAs IC Market

DUBLIN, April 11, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/f5zjtc/the_gaas_ic_market) has announced the addition of the "The GaAs IC Market" report to their offering.
     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market is the handset segment. Much of the content of a handset is silicon-based, but power amplifiers (PAs) and switches in the front-end of the phone use GaAs devices.

This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed.

This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

2.1 Summary of Major Issues
2.2 Summary of Market Forecast

Chapter 3 Technology Issues

3.1 GaAs Devices
3.1.1 FETs
3.1.2 HEMTs
3.1.3 HBT
3.2 Comparison of Logic Structures
3.2.1 Buffered FET Logic
3.2.2 FET Logic
3.2.3 Capacitively Enhanced Logic
3.2.4 Direct-Coupled FET Logic
3.2.5 Source-Coupled FET Logic
3.3 Material Issues
3.3.1 Wafer Production
3.3.2 Etch Pit Densities
3.4 Equipment
3.4.1 Implanters
3.4.2 Lithography
3.4.3 Etching
3.4.4 Deposition
3.4.5 Rapid Thermal Processing
3.5 Packaging
3.5.1 Package Types
3.5.2 Bonding
3.6 Testing
3.7 Design

Chapter 4 Applications for GaAs ICs

4.1 Introduction
4.1.1 The Trend Toward Higher Frequencies
4.1.2 Transition from Analog to Digital Modulation
4.1.3 Discrete Components and Silicon-Based ICs
4.2 Markets
4.2.1 Telecommunications Systems
4.2.2 Television Systems
4.2.3 Computing
4.2.4 Data Communications
4.2.5 Automotive
4.2.6 Automated Test Equipment
4.2.7 Military

Chapter 5 IC Supplier and End-User Issues

5.1 Introduction
5.2 Competing Against Silicon
5.3 Competing Against The Japanese
5.4 Taiwan's Market Momentum
5.5 Korea's Market Momentum
5.6 Wafer Sizes
5.7 Competing Against SiGe
5.7.1 Introduction
5.7.2 Technology
5.7.2.1 Strained Silicon
5.7.2.2 Device Manufacturing
5.7.3 Applications
5.7.3.1 Wireless LAN
5.7.3.2 WiMAX
5.7.3.3 Bluetooth
5.7.3.4 Cellular
5.7.3.5 GPS

Chapter 6 Market Forecast

6.1 Driving Forces
6.2 Market Forecast Assumptions
6.3 GaAs IC Market Forecast
6.4 SiGe IC Market Forecast
6.5 End Application Market

Chapter 7 Profile of GaAs IC Manufacturers



For more information visit http://www.researchandmarkets.com/research/f5zjtc/the_gaas_ic_market


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


SOURCE Research and Markets

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