Welcome!

Mobile IoT Authors: Shelly Palmer, Elizabeth White, Liz McMillan, Janakiram MSV, Pat Romanski

News Feed Item

Tensilica Unveils IVP -- A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications

IVP Offloads Host CPU While Providing a 10 to 20x Peak Performance Boost

SANTA CLARA, CA -- (Marketwire) -- 02/12/13 -- Tensilica®, Inc. today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex image/video signal processing functions in mobile handsets, tablets, digital televisions (DTV), automotive, video games and computer vision based applications. The IVP DPU is a much needed breakthrough product in terms of energy efficiency and performance in current products and to enable applications never before possible in a programmable device. IVP is supported by a network of third-party application developers who are actively porting leading-edge image applications to the IVP platform including innovative multi-frame image capture and video pre- and post-processing algorithms, as well as established yet evolving technologies such as video stabilization, high dynamic range (HDR) image, video HDR, object and face recognition and tracking, low-light image enhancement, digital zoom and gesture recognition.

The IVP DSP has a unique instruction set tuned for imaging and video pixel processing that gives it an instruction throughput of over 16x the number of 16-bit pixel operations compared to that of the typical host CPU with single-issue vector instructions. In addition to its raw instruction throughput advantage to host CPUs, the imaging specific compound instructions supported by IVP give it a higher peak performance of 10 to 20x and much higher energy efficiency. IVP's rich instruction set has more than 300 imaging, video and vision-oriented vector operations, each of which applies to 32 or more 16-bit pixels per cycle.

"As mobile camera usage grows, so grows the demand for advanced video and imaging features, which must be offloaded from the host processor for the best performance and the longest possible battery life," stated Will Strauss, president of Forward Concepts and a leading DSP analyst. "Given the pace of innovation in image and video processing, the new IVP core should help Tensilica's customers get efficient chips implementing proprietary algorithms to market much faster and with the added benefit of lowering the cost of changing those algorithms."

"Consumers want advanced imaging functions like HDR, but the shot-to-shot time with the current technology is several seconds, which is way too long. Users want it to work 50x faster. We can give consumers the instant-on, high-quality image and video capture they want," stated Chris Rowen, Tensilica's founder and CTO. "The IVP architecture supports very high-quality image and video capture using advanced single-frame and multi-frame processing, supporting increasing sensor resolutions. It is ideal for tomorrow's exciting new products."

Efficient Processor-based Architecture
Tensilica's IVP is based on a 4-way VLIW (very long instruction word) architecture that delivers high parallelism intermixed with code-compact instructions, with a 32-way vector SIMD (single instruction, multiple data) dataset. The architecture includes an integrated DMA (direct memory access) transfer engine with up to 10 GBytes/second of throughput and local memory throughput of 1024 bits per cycle (sixty-four 16-bit pixels/cycle) to keep up with the rapid pace of resolution and frame rate requirements. The IVP also features many imaging-specific operations to accelerate 8-, 16- and 32-bit pixel data types and video operation patterns.

The IVP is extremely power efficient. As an example, for IVP implemented in an automatic synthesis, place-and-route flow in 28nm HPM process, regular Vt, a 32-bit integral image computation on 16-bit pixel data at 1080p30 consumes 10.8 mW. The integral image function is commonly used in applications such as face and object detection and gesture recognition.

IVP's high performance is demonstrated by complex algorithm kernels such as motion search and normalized cross-correlation, commonly used in high-precision block and feature matching and optical flow. For a smart motion search on 16-bit data over a 1920x1080 frame with 256x16 pixel search range and 9x3 pixel block size, IVP can achieve a rate of 142 sums of absolute differences per cycle. In addition, a normalized cross-correlation function on 16-bit pixel data with 32-bit accuracy achieves 1 million 8x8 blocks per second.

Software
Many companies have proprietary imaging and computer vision algorithms which can be implemented on the IVP, as it employs the C programming model common among all Tensilica DPUs. Tensilica has also created a partner network to enable availability of pre-ported, efficient third-party imaging software. Initial partner companies porting advanced imaging suites to the IVP DPU include Almalence, Irida Labs, Dream Chip Technologies and Morpho, Inc.

Tensilica's state-of-the-art toolset enables easy programming of proprietary algorithms for higher performance and differentiation. "We were impressed with the ease of porting and optimizing our application to Tensilica's IVP," stated Eugene Panich, CEO of Almalence. "Tensilica's compiler helped us achieve high performance and is among the best we've ever used. We were also impressed with the quality of their entire toolset."

"We were excited to partner with Tensilica to offer our embedded vision applications since the IVP offers so much performance compared to other platforms," said Vassilis Tsagaris, CEO of Irida Labs. "The power efficiency we've seen for our video stabilizer, for example, makes IVP the perfect offload engine for imaging."

Customizable for Differentiation
Tensilica's IVP DPU can be further customized using Tensilica's patented processor-generation system. The DPU creation process is totally automated and fully supported by a matching software tool chain. The tool chain includes an optimized compiler, linker, assembler and debugger, plus a matching fast instruction set simulator.

Availability
Early-access lead customers took delivery of IVP last year, and the IVP DPU is available for broad licensing now.

About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Press Contacts:

Paula Jones
(408) 327-7343
Email Contact

Erika Powelson
(831) 424-1811
Email Contact

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
The Internet giants are fully embracing AI. All the services they offer to their customers are aimed at drawing a map of the world with the data they get. The AIs from these companies are used to build disruptive approaches that cannot be used by established enterprises, which are threatened by these disruptions. However, most leaders underestimate the effect this will have on their businesses. In his session at 21st Cloud Expo, Rene Buest, Director Market Research & Technology Evangelism at Ara...
SYS-CON Events announced today that N3N will exhibit at SYS-CON's @ThingsExpo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. N3N’s solutions increase the effectiveness of operations and control centers, increase the value of IoT investments, and facilitate real-time operational decision making. N3N enables operations teams with a four dimensional digital “big board” that consolidates real-time live video feeds alongside IoT sensor data a...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devic...
Mobile device usage has increased exponentially during the past several years, as consumers rely on handhelds for everything from news and weather to banking and purchases. What can we expect in the next few years? The way in which we interact with our devices will fundamentally change, as businesses leverage Artificial Intelligence. We already see this taking shape as businesses leverage AI for cost savings and customer responsiveness. This trend will continue, as AI is used for more sophistica...
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
SYS-CON Events announced today that DXWorldExpo has been named “Global Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Digital Transformation is the key issue driving the global enterprise IT business. Digital Transformation is most prominent among Global 2000 enterprises and government institutions.
Elon Musk is among the notable industry figures who worries about the power of AI to destroy rather than help society. Mark Zuckerberg, on the other hand, embraces all that is going on. AI is most powerful when deployed across the vast networks being built for Internets of Things in the manufacturing, transportation and logistics, retail, healthcare, government and other sectors. Is AI transforming IoT for the good or the bad? Do we need to worry about its potential destructive power? Or will we...
SYS-CON Events announced today that SIGMA Corporation will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. uLaser flow inspection device from the Japanese top share to Global Standard! Then, make the best use of data to flip to next page. For more information, visit http://www.sigma-k.co.jp/en/.
SYS-CON Events announced today that Daiya Industry will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Daiya Industry specializes in orthotic support systems and assistive devices with pneumatic artificial muscles in order to contribute to an extended healthy life expectancy. For more information, please visit https://www.daiyak...
SYS-CON Events announced today that B2Cloud will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. B2Cloud specializes in IoT devices for preventive and predictive maintenance in any kind of equipment retrieving data like Energy consumption, working time, temperature, humidity, pressure, etc.
SYS-CON Events announced today that Massive Networks, that helps your business operate seamlessly with fast, reliable, and secure internet and network solutions, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. As a premier telecommunications provider, Massive Networks is headquartered out of Louisville, Colorado. With years of experience under their belt, their team of...
SYS-CON Events announced today that NetApp has been named “Bronze Sponsor” of SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. NetApp is the data authority for hybrid cloud. NetApp provides a full range of hybrid cloud data services that simplify management of applications and data across cloud and on-premises environments to accelerate digital transformation. Together with their partners, NetApp em...
SYS-CON Events announced today that Interface Corporation will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Interface Corporation is a company developing, manufacturing and marketing high quality and wide variety of industrial computers and interface modules such as PCIs and PCI express. For more information, visit http://www.i...
SYS-CON Events announced today that Mobile Create USA will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Mobile Create USA Inc. is an MVNO-based business model that uses portable communication devices and cellular-based infrastructure in the development, sales, operation and mobile communications systems incorporating GPS capabi...
SYS-CON Events announced today that Nihon Micron will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nihon Micron Co., Ltd. strives for technological innovation to establish high-density, high-precision processing technology for providing printed circuit board and metal mount RFID tags used for communication devices. For more inf...
SYS-CON Events announced today that Suzuki Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Suzuki Inc. is a semiconductor-related business, including sales of consuming parts, parts repair, and maintenance for semiconductor manufacturing machines, etc. It is also a health care business providing experimental research for...
While some developers care passionately about how data centers and clouds are architected, for most, it is only the end result that matters. To the majority of companies, technology exists to solve a business problem, and only delivers value when it is solving that problem. 2017 brings the mainstream adoption of containers for production workloads. In his session at 21st Cloud Expo, Ben McCormack, VP of Operations at Evernote, will discuss how data centers of the future will be managed, how th...
SYS-CON Events announced today that Ryobi Systems will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Ryobi Systems Co., Ltd., as an information service company, specialized in business support for local governments and medical industry. We are challenging to achive the precision farming with AI. For more information, visit http:...
SYS-CON Events announced today that MIRAI Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MIRAI Inc. are IT consultants from the public sector whose mission is to solve social issues by technology and innovation and to create a meaningful future for people.
SYS-CON Events announced today that mruby Forum will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. mruby is the lightweight implementation of the Ruby language. We introduce mruby and the mruby IoT framework that enhances development productivity. For more information, visit http://forum.mruby.org/.