Welcome!

Mobile IoT Authors: Pat Romanski, Derek Weeks, Mark Herring, Elizabeth White, Liz McMillan

News Feed Item

Tensilica Unveils IVP -- A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications

IVP Offloads Host CPU While Providing a 10 to 20x Peak Performance Boost

SANTA CLARA, CA -- (Marketwire) -- 02/12/13 -- Tensilica®, Inc. today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex image/video signal processing functions in mobile handsets, tablets, digital televisions (DTV), automotive, video games and computer vision based applications. The IVP DPU is a much needed breakthrough product in terms of energy efficiency and performance in current products and to enable applications never before possible in a programmable device. IVP is supported by a network of third-party application developers who are actively porting leading-edge image applications to the IVP platform including innovative multi-frame image capture and video pre- and post-processing algorithms, as well as established yet evolving technologies such as video stabilization, high dynamic range (HDR) image, video HDR, object and face recognition and tracking, low-light image enhancement, digital zoom and gesture recognition.

The IVP DSP has a unique instruction set tuned for imaging and video pixel processing that gives it an instruction throughput of over 16x the number of 16-bit pixel operations compared to that of the typical host CPU with single-issue vector instructions. In addition to its raw instruction throughput advantage to host CPUs, the imaging specific compound instructions supported by IVP give it a higher peak performance of 10 to 20x and much higher energy efficiency. IVP's rich instruction set has more than 300 imaging, video and vision-oriented vector operations, each of which applies to 32 or more 16-bit pixels per cycle.

"As mobile camera usage grows, so grows the demand for advanced video and imaging features, which must be offloaded from the host processor for the best performance and the longest possible battery life," stated Will Strauss, president of Forward Concepts and a leading DSP analyst. "Given the pace of innovation in image and video processing, the new IVP core should help Tensilica's customers get efficient chips implementing proprietary algorithms to market much faster and with the added benefit of lowering the cost of changing those algorithms."

"Consumers want advanced imaging functions like HDR, but the shot-to-shot time with the current technology is several seconds, which is way too long. Users want it to work 50x faster. We can give consumers the instant-on, high-quality image and video capture they want," stated Chris Rowen, Tensilica's founder and CTO. "The IVP architecture supports very high-quality image and video capture using advanced single-frame and multi-frame processing, supporting increasing sensor resolutions. It is ideal for tomorrow's exciting new products."

Efficient Processor-based Architecture
Tensilica's IVP is based on a 4-way VLIW (very long instruction word) architecture that delivers high parallelism intermixed with code-compact instructions, with a 32-way vector SIMD (single instruction, multiple data) dataset. The architecture includes an integrated DMA (direct memory access) transfer engine with up to 10 GBytes/second of throughput and local memory throughput of 1024 bits per cycle (sixty-four 16-bit pixels/cycle) to keep up with the rapid pace of resolution and frame rate requirements. The IVP also features many imaging-specific operations to accelerate 8-, 16- and 32-bit pixel data types and video operation patterns.

The IVP is extremely power efficient. As an example, for IVP implemented in an automatic synthesis, place-and-route flow in 28nm HPM process, regular Vt, a 32-bit integral image computation on 16-bit pixel data at 1080p30 consumes 10.8 mW. The integral image function is commonly used in applications such as face and object detection and gesture recognition.

IVP's high performance is demonstrated by complex algorithm kernels such as motion search and normalized cross-correlation, commonly used in high-precision block and feature matching and optical flow. For a smart motion search on 16-bit data over a 1920x1080 frame with 256x16 pixel search range and 9x3 pixel block size, IVP can achieve a rate of 142 sums of absolute differences per cycle. In addition, a normalized cross-correlation function on 16-bit pixel data with 32-bit accuracy achieves 1 million 8x8 blocks per second.

Software
Many companies have proprietary imaging and computer vision algorithms which can be implemented on the IVP, as it employs the C programming model common among all Tensilica DPUs. Tensilica has also created a partner network to enable availability of pre-ported, efficient third-party imaging software. Initial partner companies porting advanced imaging suites to the IVP DPU include Almalence, Irida Labs, Dream Chip Technologies and Morpho, Inc.

Tensilica's state-of-the-art toolset enables easy programming of proprietary algorithms for higher performance and differentiation. "We were impressed with the ease of porting and optimizing our application to Tensilica's IVP," stated Eugene Panich, CEO of Almalence. "Tensilica's compiler helped us achieve high performance and is among the best we've ever used. We were also impressed with the quality of their entire toolset."

"We were excited to partner with Tensilica to offer our embedded vision applications since the IVP offers so much performance compared to other platforms," said Vassilis Tsagaris, CEO of Irida Labs. "The power efficiency we've seen for our video stabilizer, for example, makes IVP the perfect offload engine for imaging."

Customizable for Differentiation
Tensilica's IVP DPU can be further customized using Tensilica's patented processor-generation system. The DPU creation process is totally automated and fully supported by a matching software tool chain. The tool chain includes an optimized compiler, linker, assembler and debugger, plus a matching fast instruction set simulator.

Availability
Early-access lead customers took delivery of IVP last year, and the IVP DPU is available for broad licensing now.

About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Press Contacts:

Paula Jones
(408) 327-7343
Email Contact

Erika Powelson
(831) 424-1811
Email Contact

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
Nordstrom is transforming the way that they do business and the cloud is the key to enabling speed and hyper personalized customer experiences. In his session at 21st Cloud Expo, Ken Schow, VP of Engineering at Nordstrom, discussed some of the key learnings and common pitfalls of large enterprises moving to the cloud. This includes strategies around choosing a cloud provider(s), architecture, and lessons learned. In addition, he covered some of the best practices for structured team migration an...
Recently, REAN Cloud built a digital concierge for a North Carolina hospital that had observed that most patient call button questions were repetitive. In addition, the paper-based process used to measure patient health metrics was laborious, not in real-time and sometimes error-prone. In their session at 21st Cloud Expo, Sean Finnerty, Executive Director, Practice Lead, Health Care & Life Science at REAN Cloud, and Dr. S.P.T. Krishnan, Principal Architect at REAN Cloud, discussed how they built...
In his session at 21st Cloud Expo, Raju Shreewastava, founder of Big Data Trunk, provided a fun and simple way to introduce Machine Leaning to anyone and everyone. He solved a machine learning problem and demonstrated an easy way to be able to do machine learning without even coding. Raju Shreewastava is the founder of Big Data Trunk (www.BigDataTrunk.com), a Big Data Training and consulting firm with offices in the United States. He previously led the data warehouse/business intelligence and B...
In his Opening Keynote at 21st Cloud Expo, John Considine, General Manager of IBM Cloud Infrastructure, led attendees through the exciting evolution of the cloud. He looked at this major disruption from the perspective of technology, business models, and what this means for enterprises of all sizes. John Considine is General Manager of Cloud Infrastructure Services at IBM. In that role he is responsible for leading IBM’s public cloud infrastructure including strategy, development, and offering m...
With tough new regulations coming to Europe on data privacy in May 2018, Calligo will explain why in reality the effect is global and transforms how you consider critical data. EU GDPR fundamentally rewrites the rules for cloud, Big Data and IoT. In his session at 21st Cloud Expo, Adam Ryan, Vice President and General Manager EMEA at Calligo, examined the regulations and provided insight on how it affects technology, challenges the established rules and will usher in new levels of diligence arou...
The 22nd International Cloud Expo | 1st DXWorld Expo has announced that its Call for Papers is open. Cloud Expo | DXWorld Expo, to be held June 5-7, 2018, at the Javits Center in New York, NY, brings together Cloud Computing, Digital Transformation, Big Data, Internet of Things, DevOps, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
Smart cities have the potential to change our lives at so many levels for citizens: less pollution, reduced parking obstacles, better health, education and more energy savings. Real-time data streaming and the Internet of Things (IoT) possess the power to turn this vision into a reality. However, most organizations today are building their data infrastructure to focus solely on addressing immediate business needs vs. a platform capable of quickly adapting emerging technologies to address future ...
No hype cycles or predictions of a gazillion things here. IoT is here. You get it. You know your business and have great ideas for a business transformation strategy. What comes next? Time to make it happen. In his session at @ThingsExpo, Jay Mason, an Associate Partner of Analytics, IoT & Cybersecurity at M&S Consulting, presented a step-by-step plan to develop your technology implementation strategy. He also discussed the evaluation of communication standards and IoT messaging protocols, data...
22nd International Cloud Expo, taking place June 5-7, 2018, at the Javits Center in New York City, NY, and co-located with the 1st DXWorld Expo will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud ...
22nd International Cloud Expo, taking place June 5-7, 2018, at the Javits Center in New York City, NY, and co-located with the 1st DXWorld Expo will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud ...
DevOps at Cloud Expo – being held June 5-7, 2018, at the Javits Center in New York, NY – announces that its Call for Papers is open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and web-scale businesses, DevOps is expanding to organizations of all sizes, including the world's largest enterprises – and delivering real results. Among the proven benefits,...
@DevOpsSummit at Cloud Expo, taking place June 5-7, 2018, at the Javits Center in New York City, NY, is co-located with 22nd Cloud Expo | 1st DXWorld Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait...
Cloud Expo | DXWorld Expo have announced the conference tracks for Cloud Expo 2018. Cloud Expo will be held June 5-7, 2018, at the Javits Center in New York City, and November 6-8, 2018, at the Santa Clara Convention Center, Santa Clara, CA. Digital Transformation (DX) is a major focus with the introduction of DX Expo within the program. Successful transformation requires a laser focus on being data-driven and on using all the tools available that enable transformation if they plan to survive ov...
SYS-CON Events announced today that T-Mobile exhibited at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on qua...
SYS-CON Events announced today that Cedexis will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Cedexis is the leader in data-driven enterprise global traffic management. Whether optimizing traffic through datacenters, clouds, CDNs, or any combination, Cedexis solutions drive quality and cost-effectiveness. For more information, please visit https://www.cedexis.com.
SYS-CON Events announced today that Google Cloud has been named “Keynote Sponsor” of SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Companies come to Google Cloud to transform their businesses. Google Cloud’s comprehensive portfolio – from infrastructure to apps to devices – helps enterprises innovate faster, scale smarter, stay secure, and do more with data than ever before.
SYS-CON Events announced today that Vivint to exhibit at SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California. As a leading smart home technology provider, Vivint offers home security, energy management, home automation, local cloud storage, and high-speed Internet solutions to more than one million customers throughout the United States and Canada. The end result is a smart home solution that sav...
SYS-CON Events announced today that Opsani will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Opsani is the leading provider of deployment automation systems for running and scaling traditional enterprise applications on container infrastructure.
SYS-CON Events announced today that Nirmata will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nirmata provides a comprehensive platform, for deploying, operating, and optimizing containerized applications across clouds, powered by Kubernetes. Nirmata empowers enterprise DevOps teams by fully automating the complex operations and management of application containers and its underlying ...
SYS-CON Events announced today that Opsani to exhibit at SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California. Opsani is creating the next generation of automated continuous deployment tools designed specifically for containers. How is continuous deployment different from continuous integration and continuous delivery? CI/CD tools provide build and test. Continuous Deployment is the means by which...