| By Business Wire |
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| February 7, 2013 10:00 PM EST |
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451 |
Toshiba
Corporation (TOKYO:6502) today announced that it has started sample
shipments of a 64-gigabyte (GB) embedded NAND flash memory module, the
first in the industry equipped with a UFS I/F. The module is fully
compliant with the JEDEC UFS Ver.1.1 standard[3] and is
designed for application in a wide range of digital consumer products,
including smartphones, tablet PCs.
Toshiba Corporation announced that it has started sample shipments of a 64-gigabyte (GB) embedded NAND flash memory module, the first in the industry equipped with a UFS I/F. (Photo: Business Wire)
Samples are mainly intended for evaluation of UFS I/F and its protocol
in host chipsets and by OS vendors.
Demand continues to grow for large density, high-performance chips that
support high resolution video, driven by improved data-processing speeds
in host chipsets and wider bandwidths for wireless connectivity.
Toshiba has proved itself an innovator in this key area, and is now
reinforcing its leadership by being first in the industry to support
samples with a 64GB UFS module.
Toshiba will schedule mass-production and other densities in its line-up
according to market demand.
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Product
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Part Number
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Density
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Package
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Sample shipment
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THGLF0G9B8JBAIE
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64GB
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169Ball 12×16×1.2mm FBGA
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January 2013
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Key Features
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The JEDEC UFS Ver.1.1 compliant interface handles
essential functions, including writing block management, error
correction and driver software. It simplifies system development,
allowing manufacturers to minimize development costs and speed up time
to market for new and upgraded products.
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UFS I/F has a serial I/F. It has the scalability in number of lanes
and speed[4].
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The new products are sealed in a small FBGA package, 12x16x1.2mm, and
have a signal layout compliant with JEDEC UFS Ver.1.1.
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[1]
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For embedded NAND flash memory modules. Source: Toshiba, as of
February 2013.
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[2]
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Universal Flash Storage is a product category for a class of
embedded memory products built to the JEDEC UFS standard
specification.
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[3]
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JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0
standard is now under discussion by JEDEC.
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[4]
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JEDEC UFS Ver.2.0 standard will support multiple-lane and I/F speed.
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Specifications
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Interface
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JEDEC UFS Version 1.1 standard
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Power Supply Voltage
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2.7V to 3.6V (Memory core）
1.70V to 1.95V （Controller core）
1.10V to 1.30V (UFS I/F signals)
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Number of lane
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Downstream 1lane / Upstream 1lane
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I/F Speed
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2.9Gbps/lane
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Temperature range
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-25degrees to +85degrees Celsius
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Package
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169Ball 12x16x1.2mm FBGA,
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About Toshiba
Toshiba is a world-leading diversified manufacturer, solutions provider
and marketer of advanced electronic and electrical products and systems.
Toshiba Group brings innovation and imagination to a wide range of
businesses: digital products, including LCD TVs, notebook PCs, retail
solutions and MFPs; electronic devices, including semiconductors,
storage products and materials; industrial and social infrastructure
systems, including power generation systems, smart community solutions,
medical systems and escalators & elevators; and home appliances.
Visit Toshiba's web site at www.toshiba.co.jp/index.htm
Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20130207006772/en/
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