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A TD-LTE Thematic Pavilion Will Be Open at CHTF2012

SHENZHEN, China, Nov. 13, 2012 /PRNewswire/ -- As a sponsor of the China Hi-Tech Fair (CHTF), the Ministry of Industry and Information Technology of the P. R.C. (MIIT) will arrange a pavilion for TD-LTE at CHTF 2012 in Shenzhen on November 16-21, so as to better display the TD-LTE R&D and industrialization level in China and to popularize and promote the innovative technological achievements in the complete industrial chains such as system devices, chips, terminals, test instruments and service applications, etc.

In the preparatory meeting of this TD-LTE Thematic Pavilion, Mr. Yang Xueshan, deputy minister of MIIT, summarized that it has attracted much attention from the leaders of the Central Government and the society, and shall surely become one of the important highlights of CHTF 2012.

The pavilion will start with the guidance of a healthy industrial development and promotion of industrial transition, and then focus on industry upgrades and the industrialization of TD-LTE technologies as the core. The organizers of this pavilion have invited mobile operators, pilot cities, communication equipment manufacturers and leading domestic and foreign enterprises in relevant industries to exhibit their innovative technologies and demonstrative applications in the complete industrial chains covering the TD-LTE system, chips, terminals and test instruments. Exhibitors will also show the technologies, equipments and solutions for supporting and realizing 4G services.

The pavilion is 7,500m2 in area, and covers the complete industrial chains of TD-LTE and focuses on the new technologies and application achievements. It is composed of four categories. The first is technological R&D, including research on key technologies in such sectors as wireless communication, networking scheme, network planning and optimization, network security and tests, as well as the development of relevant domestic and foreign standards, etc.; the second is product R&D, including system devices, terminals, chips, antennas, test instruments as well as peripheral products etc; the third is service applications, including telecom value-added services, mobile Internet services, typical industrial applications as well as the application and solutions etc. in such fields as industrial production, e-government affairs, improvement of people's well-being and wireless cities etc.; the fourth is the platforms, including platforms supporting the R&D of key technologies, platforms for tests and demonstrations and platforms for business application services, etc..

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